| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
ASCEN Technology | https://www.ascen.ltd/optical_inspection/510.html
; the good solder in the tin residue and the real oxide, the solder without any pollution or quality or quantity changes; Wet separation method
ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/510.html
; the good solder in the tin residue and the real oxide, the solder without any pollution or quality or quantity changes; Wet separation method
Imagineering, Inc. | https://www.pcbnet.com/blog/pcbs-and-the-environment/
. Copper used in PCB edging, etching solution, and stripping solution can be recycled as well as copper oxide found in wastewater. Tin found in tin or lead soldering is also frequently recycled and reused in other products
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements (e.g
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
dominant. The reaction for indium oxide is suspected to be similar to that of tin oxide. The resultant indium formate is eliminated through sublimation. VI. CAUSES OF VOIDING Several types of solder voids have been noted [14], most of which are related to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Formic acid reflow has been developed in industry as a fluxless reflow technology. During the process, formic acid vapor in a nitrogen atmosphere is introduced into the oven as an oxide removal agent
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Oxide and Lamination With all of the layers etched, a chemical treatment called oxide is applied to the inner layers of a printed circuit board to improve the strength of the bond
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Activator is consumed by heat over time. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements
