Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
). Figure 2 shows a sample lead-free reflow profile. Figure 2. A sample lead-free reflow profile Since it is a 32 factorial design with three replications, 27 boards were assembled using SnPb paste and 27 boards were assembled using SAC305 paste
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Kim Abstract 14-1 AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer Abstract 14-1 EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V.Srirama Sastry Abstract 2000 13-4 EFFECTS
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied