ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-automatic-solder-nozzle-tinning-system-ensures-consistent-quality
. Since the automatic solder nozzle tinning system does not produce overspray or contamination of the printed circuit board assembly or selective soldering machine, it is advantageous for clean
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/solder-nozzle-cleaning
overspray of caustic materials and does not contaminate printed circuit board assembly or selective soldering machine - Eliminates manual solder nozzle re-tinning minimizing machine downtime - Available on Novo ® 460, Cerno ® 508.1, Integra ® 508.2, 508.3, 508.4 and 508.5 models Overview
| http://www.szhonreal.com/productview.asp?id=111
● Machine options Automatic tinning function Automatic stencil plugging detection function Automatic dispensing function, scraper pressure feedback function
| http://www.szhonreal.com/productview.asp?id=110
● Machine options Automatic tinning function Automatic stencil plugging detection function Automatic dispensing function, scraper pressure feedback function
| http://www.szhonreal.com/productview.asp?id=112
● Machine options Automatic tinning function Automatic stencil plugging detection function Automatic dispensing function, scraper pressure feedback function
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/Products/Electronics-Solutions-Products/SELECT-Solder-Nozzle-Cleaning-2
and does not contaminate printed circuit board assembly or selective soldering machine Eliminates manual solder nozzle re-tinning minimizing machine downtime Available on Novo® 460, Cerno® 508.1, Integra® 508.2, 508.3, 508.4 and 508.5 models Overview
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/select/about/news/nordson-select-to-exhibit-advanced-selective-soldering-technology-at-the-2019-smta-guadalajara-expo
103IL selective soldering system featuring Industry 4.0 data push protocol and automatic solder nozzle re-tinning " /> SELECT Products Unternehmen
