Partner Websites: under etch (Page 1 of 3)

SON / QFN Calculations - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic889&OB=DESC.html

 for high-reliability hardware.  For instance, we have found several vendors that recommend a solder mask defined center pad.  We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible

PCB Libraries, Inc.

SON / QFN Calculations - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/son-qfn-calculations_topic889_post3258.html

 from sheet copper in an array, the tolerance of the pads vary uniformly (for the most part) with respect to the etch process.  This means that if the center pad is over-etched then

PCB Libraries, Inc.

SON / QFN Calculations - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic889&OB=ASC.html

 from sheet copper in an array, the tolerance of the pads vary uniformly (for the most part) with respect to the etch process.  This means that if the center pad is over-etched then

PCB Libraries, Inc.

Terms & Conditions | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/legal/terms-and-conditions

. Standard Nordson MARCH Acceptance Criteria are outlined as follows: (VIA-Series, PCB-Series) For printed circuit board (PCB) applications, equipment uniformity and etch rate will be determined by standards and procedures outlined in Vacuum Plasma Desmear Uniformity Measurement for Rigid and Flex Printed Circuit Boards

ASYMTEK Products | Nordson Electronics Solutions

No Option For Pad Round-off In V2021 Edition? - PCB Libraries Forum - Page 2

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/no-option-for-pad-roundoff-in-v2021-edition_topic2866_post11591.html

: 3 Post Options Post Reply Quote Quist Report Post    Thanks(0)    Quote    Reply Posted: 09 Apr 2021 at 11:07am Ah, no I was not referring to the Naming Convention but rather to the actual pad dimensions presented under Footprint

PCB Libraries, Inc.

No Option For Pad Round-off In V2021 Edition? - PCB Libraries Forum - Page 2

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-option-for-pad-roundoff-in-v2021-edition_topic2866_post11693.html

: 3 Post Options Post Reply Quote Quist Report Post    Thanks(0)    Quote    Reply Posted: 09 Apr 2021 at 11:07am Ah, no I was not referring to the Naming Convention but rather to the actual pad dimensions presented under Footprint

PCB Libraries, Inc.

No Option For Pad Round-off In V2021 Edition? - PCB Libraries Forum - Page 2

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/no-option-for-pad-roundoff-in-v2021-edition_topic2866_post11452.html

: 3 Post Options Post Reply Quote Quist Report Post    Thanks(0)    Quote    Reply Posted: 09 Apr 2021 at 11:07am Ah, no I was not referring to the Naming Convention but rather to the actual pad dimensions presented under Footprint

PCB Libraries, Inc.

No Option For Pad Round-off In V2021 Edition? - PCB Libraries Forum - Page 2

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-option-for-pad-roundoff-in-v2021-edition_topic2866_post11455.html

: 3 Post Options Post Reply Quote Quist Report Post    Thanks(0)    Quote    Reply Posted: 09 Apr 2021 at 11:07am Ah, no I was not referring to the Naming Convention but rather to the actual pad dimensions presented under Footprint

PCB Libraries, Inc.

No Option For Pad Round-off In V2021 Edition? - PCB Libraries Forum - Page 1

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2866&OB=DESC.html

. I even seriously doubt that there is any practical benefit with going below 0.01 accuracy. Normal trace tolerance in an etch proces is probably around

PCB Libraries, Inc.

Auction - TS Leiterplatten | The Branford Group

| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx

Höllmüller LPI Developer with flexible transport Pill Pre-Clean Mec Etch Bond for paint + inner layers Höllmüller Anti-Tarnish for inner layers Mec Laif Shadow Line - Direct Metallization Laif Resist Stripper with cyclone Schmid Tin Stripper Laif Ni/Au manual electroplating w/post-cleaning + dryer Laif Ni/Au – chem

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