GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/dispensing-underfill-encapsulation-dam-fill.php
Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php
Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/heatConfigurations-max2.php
Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/underfill-dispense-software.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/underfill-dispense-path-optimization.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/MAX-II-Dispense-System.pdf
. . . . . . . . . . . . . . . . . . . . . . . . . . . 69 cm/sec (27”/sec) *With system mapping over standard work area. Dimensions & Weight Work Area (X, Y, height): 2 pump stations . . . . . . . . . . . . . . . . . . 31 x 31 x 8 cm (12” x 12” x 3 .25”) 1 pump station . . . . . . . . . . . . . . . . . . . 36 x 31 x 8 cm (14 .1” x 12” x 3 .25”) Footprint (W x D x H) . . . . . . . . . . . . . . . . . . . 135 x 119 x 199 cm
GPD Global | https://www.gpd-global.com/pdf/dispense/MAX-II-Dispense-System.pdf
. . . . . . . . . . . . . . . . . . . . . . . . . . . 69 cm/sec (27”/sec) *With system mapping over standard work area. Dimensions & Weight Work Area (X, Y, height): 2 pump stations . . . . . . . . . . . . . . . . . . 31 x 31 x 8 cm (12” x 12” x 3 .25”) 1 pump station . . . . . . . . . . . . . . . . . . . 36 x 31 x 8 cm (14 .1” x 12” x 3 .25”) Footprint (W x D x H) . . . . . . . . . . . . . . . . . . . 135 x 119 x 199 cm
GPD Global | https://www.gpd-global.com/co_website/process-calibration.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
