Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
2015 Micron KEG Supplier Summit CONFIDENTIAL Heller Industries Advanced Oven Technology --Fluxless Reflow-- CONFIDENTIAL Reflow in Formic Acid Vapor
| https://www.smtfactory.com/I-C-T-M6-Best-Vacuum-Smt-Pick-And-Place-Machine-Manufacturers-For-Pcb-Assembly-pd48850164.html
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/flux.pdf
). Cooling air from outside the oven cools the external surfaces of the condenser tubes. The flow direction of the cooling air is opposite the direction of the flux vapor flow to provide the most efficient cooling
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/flux.pdf
). Cooling air from outside the oven cools the external surfaces of the condenser tubes. The flow direction of the cooling air is opposite the direction of the flux vapor flow to provide the most efficient cooling
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
) vapor to act as a reducing agent to oxides on metal solder, replacing the need for flux. Eliminates issues related to residual flux, such as voiding Process steps related to flux, such as for pre-reflow fluxing and post-reflow flux cleanup steps are no longer needed, saving time, money, and floor space
Heller Industries Inc. | https://hellerindustries.com/wicking-defetcs/
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. The standard says that the same footprint pattern can be used for reflow, infrared, vapor phase, full wave and selective wave solder processes.
Heller Industries Inc. | https://hellerindustries.com/wicking-defects/
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic995&OB=ASC.html
. The standard says that the same footprint pattern can be used for reflow, infrared, vapor phase, full wave and selective wave solder processes
