| http://etasmt.com/te_news_bulletin/2021-09-02/24965.chtml
Production Line Solutions , SMT AutomatIC PCB Solder Paste Printing Machine , AutomatIC Stencil Printer , Best Reflow Oven , Vapor Phase Reflow Oven , Mini Wave Soldering Machine , PICk-And-Place Automation , Chip Mounter Equipment , Chip Mounter Desktop , Chip Mounter Feeder , PanasonIC
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23566.chtml
:26 Flux-Free Formic Reflow Soldering Flux-Free Formic Reflow in Formic Acid Vapor I.C.T has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering
| http://etasmt.com/te_news_bulletin/2021-08-31/23566.chtml
:10 Flux-Free Formic Reflow Soldering Flux-Free Formic Reflow in Formic Acid Vapor I.C.T has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering
| https://ipcapexexpo.org/education/call-for-participation
) Process Vapor Phase Warpage-induced Defect Mitigation PCB Fabrication and Materials 5G Additive and Semi-Additive Processes Black Pad and Other Board Related Defects CAF HDI Technology High Frequency
Lewis & Clark | https://www.lewis-clark.com/product/ransco-7210-2-temperature-cycling-chamber/
: Vertical Two-Zone Temperature Cycling Chamber Vintage: 2000 Details: 480v – 3 Phase – 60Hz Temperature Range -70°C -200°C Condition: Complete & Operational Location
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Rakesh Kumar of Specialty Coatings will present on thermally-stable, vapor-phase conformal coating for protection of electronics in harsh environments
| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print
Automatic PCB Solder Paste Printing Machine , Automatic Stencil Printer , Best Reflow Oven , Vapor Phase Reflow Oven , Mini Wave Soldering Machine , Pick-And-Place Automation , Chip Mounter Equipment , Chip Mounter Desktop , Chip Mounter Feeder , Panasonic
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
? The chemistry involved with formic acid reflow is a two-step process: During the soak phase of a thermal profile (between ~ 150C and 200C), formic acid vapor is introduced into the process chamber where it reacts with the metal oxides on the solder and creates formate salts