147 via fill hole short results

Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work

| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements

Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

PCB Libraries Forum : PCB Via Terms and Applications

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml

. Tenting means covering via with solder mask. This is a requirement for any vias under a BGA to prevent solder bridging short circuits during the assembly process.   Capped Vias

PCB Libraries, Inc.

PCB Via Terms and Applications - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html

. Tenting means covering via with solder mask. This is a requirement for any vias under a BGA to prevent solder bridging short circuits during the assembly process.     Capped Vias

PCB Libraries, Inc.

PCB Via Terms and Applications - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1596&OB=ASC.html

. Tenting means covering via with solder mask. This is a requirement for any vias under a BGA to prevent solder bridging short circuits during the assembly process.     Capped Vias

PCB Libraries, Inc.

PCB Libraries Forum : VIA Guidance Request From Tim C.

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml

. If the design requires that Analog and Digital signals need to share then those signals will require a through-hole via or a buried via.  

PCB Libraries, Inc.

VIA Guidance Request From Tim C. - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic538&OB=ASC.html

 "Proper Metric Etiquette" from PCB Libraries   It list the VIA to Track selection and good VIA hole to Pad info too.   Actually it would be nice if the Optimal VIA Padstack information could be expanded to include wider traces, at the present it covers up to 0.15 mm traces

PCB Libraries, Inc.

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/soldertip/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39

PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft

| https://unisoft-cim.com/solder.php

PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days

 Flux penetration into plated through hole  Depth of the board in the wave 10 #2 Insufficient PTH Fill And Voids Within Solder Joints Voids in the solder plated through hole solder joints can be caused by

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PCB Libraries Forum : Library Expert 2016.07 Released!!

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-07-released_topic1912.xml

. Recommended Footprint “L1” dimension would not allow user to edit the valueThrough-hole Oscillator Physical Description was OSC and fixed to OscillatorFixed the Triangle Polarity Marker to Fill correctlyHeaders

PCB Libraries, Inc.