ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/events/event-detail-page
. Een dag vol verrassingen Altijd al willen weten wat er dagelijks achter onze muren gebeurt? Deze Open Dag is een unieke kans voor een eerste of hernieuwde kennismaking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/events/open-company-route-open-bedrijven-route-2019-deurne
. Een dag vol verrassingen Altijd al willen weten wat er dagelijks achter onze muren gebeurt? Deze Open Dag is een unieke kans voor een eerste of hernieuwde kennismaking
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, Prediction,” Soldering and Surface Mount Technology, vol. 1, no. 1, 14-22, February, 1989. [9] Richard J. Coyle, Diane E. Hodges Popps, Andrew Mawer, Donald P. Cullen, George M. Wenger, and Patrick P. Solan, “The Effect of Modifications to the Nickel/Gold
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
, Prediction,” Soldering and Surface Mount Technology, vol. 1, no. 1, 14-22, February, 1989. [9] Richard J. Coyle, Diane E. Hodges Popps, Andrew Mawer, Donald P. Cullen, George M. Wenger, and Patrick P. Solan, “The Effect of Modifications to the Nickel/Gold
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
, Prediction,” Soldering and Surface Mount Technology, vol. 1, no. 1, 14-22, February, 1989. [9] Richard J. Coyle, Diane E. Hodges Popps, Andrew Mawer, Donald P. Cullen, George M. Wenger, and Patrick P. Solan, “The Effect of Modifications to the Nickel/Gold
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
Formation Between Sn/Ag/Cu Solder Components and Printed Circuit Boards,” Soldering and Surface Mount Technology, Vol. 14 No. 2, pp.18-25, 2002. Bentzen, B., “Reflow Soldering,” SMT in FOCUS, Oct. 2000, available at www.smtinfocus.com Handwerker, C. (2005
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
Formation Between Sn/Ag/Cu Solder Components and Printed Circuit Boards,” Soldering and Surface Mount Technology, Vol. 14 No. 2, pp.18-25, 2002. Bentzen, B., “Reflow Soldering,” SMT in FOCUS, Oct. 2000, available at www.smtinfocus.com Handwerker, C. (2005
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Bodo's Power Systems Dec 2010 IGBT MODULES FOR ELECTRIC HYBRID VEHICLES As Published in Fuji Electric Review Vol. 53, No. 3 Microelectronics - Plastic IC Packaging/PEM ACOUSTIC IMAGING AND INSPECTION As published in Chip Scale Review October 2013 FINE TUNING ACOUSTIC SCREENING PEMS As published in Circuits Assembly May
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. "Decomposition of formic acid." Physics. chem-ph (2011). [14] Aspandiar, “Voids in Solder Joints”, SMTA Boise Expo and Tech Forum, March 20, 2018 inter alia [15] Subramanian et al., “Non-spherical bubbles”, Colloid Science, NATURE, Vol 438(15), December 2005 [16
