PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10872.html
a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note: The OD of the plane Thermal Relief is the same diameter as the plane Anti-pad
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10876.html
. All traces on all layers should be over a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586.html
. All traces on all layers should be over a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586.html
. All traces on all layers should be over a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10876.html
. All traces on all layers should be over a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2586&OB=DESC.html
a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note: The OD of the plane Thermal Relief is the same diameter as the plane Anti-pad
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2586&OB=DESC.html
a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note: The OD of the plane Thermal Relief is the same diameter as the plane Anti-pad
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2586&OB=ASC.html
. All traces on all layers should be over a copper plane and not intrude into the anti-pad area. Therefore, make the anti-pad large enough to manufacture but small enough to maintain signal integrity. Note
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipc2221-2222-and-throughhole-pad-stacks_topic2586.xml
. All traces on all layers should be over a copper plane and notintrude into the anti-pad area. Therefore, make the anti-pad large enough tomanufacture but small enough to maintain signal integrity. Note
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself
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