Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Being as common as it is, manufacturers have come to recognize many of the underlying causes that cause solder ball defects. In this blog, we outline everything you need to know about solder balls, what you can do to avoid them, and potential steps for their removal
| https://www.smtfactory.com/What-is-the-function-of-the-temperature-and-humidity-sensor-in-Lyra-Reflow-Oven-id44562477.html
formation of the solder ball during reflow. When the temperature of Lyra Reflow Oven is too high, it will also cause a similar effect, which greatly increases the probability of tailing and bridging
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. There are additional details of alloy and flux performance not covered that can be very important in the selection process. It is always worth a call to your Nordson EFD solder sales specialist to review requirements to ensure you are using the best solder paste for the job. Step 1
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
PCB Prototyping: What Should You Be Looking For? Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
. The NSMD BGA pad stack is necessary for the Ball to fully collapse around the pad edge securing it to the PCB - The SMD (Solder Mask Defined) BGA pad stack prevents the Ball Collapse
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/smd-solder-mask-defined-and-nsmd-pads_topic1768_post7236.html
Connectors. The NSMD BGA pad stack is necessary for the Ball to fully collapse around the pad edge securing it to the PCB - The SMD (Solder Mask Defined) BGA pad stack prevents the Ball Collapse
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies. UV-traceable flux
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. What is a Moisture Sensitive Device (MSD)? Moisture sensitive devices, or MSDs, are components that are packaged within plastic that are sensitive to damage related to atmospheric humidity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/042921-what-are-the-advantages-of-a-desktop-automated-dispensing-system
? Back to all posts How Speed, Positional Accuracy, and Automated Optical Inspection Take Dispensing to the Next Level By Johnathan Titone In our last blog post, What is a Desktop Automated Dispensing
