| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with 2.54um [100uin
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are using a lead-free organic rosin core solder and apply additional liquid rosin flux when soldering fine pitch components. We are running the soldering irons between 750 and 800 F
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down
. We are using a lead-free organic rosin core solder and apply additional liquid rosin flux when soldering fine pitch components. We are running the soldering irons between 750 and 800 F. Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf
| https://www.eptac.com/faqs/ask-helena-leo/page/8
... Read More J-STD-001E-2010: 4.5.1, Gold Removal Issues QUESTION Question: Since we are seeing more and more components with gold finish on the solder attachment pads
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