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. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves behind a residue which needs to be cleaned post reflow
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relay/indicator panel that provides advanced, reliable fire detection, monitoring and process shutdown capability in for greater safety in your powder coating operations
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process. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive
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