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| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. The thorough removal of flux residues, colophony, resin, oxides and soldering materials are the main tasks in the cleaning of printed circuit boards, active and passive electronic components, BGA
| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
not have mealing failures, ease of handling after the soldering operations and basically to remove any residue flux residues which may react with the operational environment where the product is to be used
| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
not have mealing failures, ease of handling after the soldering operations and basically to remove any residue flux residues which may react with the operational environment where the product is to be used
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections
not have mealing failures, ease of handling after the soldering operations and basically to remove any residue flux residues which may react with the operational environment where the product is to be used
| https://www.eptac.com/soldertips/soldertip-44-ipc-guidelines-for-flux-selection-and-use/
. This will guide you as to whether or not you need to have a cleaning process to remove these residues from the surfaces of your product
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
. You will have to define the type of solvent to be used to remove the rosin flux residues be it either manually or through a solvent cleaning systems
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
