12 why thermal pad voids dpack results

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530_post10399.html

: Most component manufacturer's recommended land pattern use the Nominal dimensions for the Thermal Pad size. This is probably the most important reason

PCB Libraries, Inc.

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/nominal-epad-vs-max-epad_topic2530_post10400.html

−GT3 The reasons you list above are a good argument to use nominal values. I find it surprising why manufacturer would recommend EP pad size larger than max value

PCB Libraries, Inc.

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530_post10400.html

−GT3 The reasons you list above are a good argument to use nominal values. I find it surprising why manufacturer would recommend EP pad size larger than max value

PCB Libraries, Inc.

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2530&OB=DESC.html

−GT3 The reasons you list above are a good argument to use nominal values. I find it surprising why manufacturer would recommend EP pad size larger than max value

PCB Libraries, Inc.

SolderTips: Issues With Incomplete Solder Reflow in Production - EPTAC - Train. Work Smarter. Succee

| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/

interface and this is a defective condition. The reasoning of why this may be happening on only a few pads of a particular component is most likely due to the heat sinking characteristics of the pad/land area

SolderTips: Defining Shear Forces for Surface Mounted Components - EPTAC - Train. Work Smarter. Succ

| https://www.eptac.com/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components/

. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc

• 16 JEDEC Documents 6 Why BGA Components •  Peripheral devices with 1.00 mm pitch have become commonplace, however these packages cannot accommodate more than 84 pins

| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf

Ask Questions | EPTAC

| https://www.eptac.com/ask/

: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75

SolderTips: Dealing with the Problems of Soldering Iron Tips Breaking Down - EPTAC - Train. Work Sma

| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/

? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena & Leo Soldertips Why Get IPC Certified Blog Webinars

International Conference for Electronics Hardware Enabling Technologies

Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm

: QFN Package Background IPC-7093 Standard Pad Design Impacts/Influences QFN Thermal Pad Voiding Manufacturing Implementation         - Stenciling         - Reflow         - Cleaning Solder Joint Reliability

Surface Mount Technology Association (SMTA)