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The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

(Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609. The components were placed using the Universal Advantis machine. Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven. This oven had 14

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2024 Eptac IPC Certification Training Schedule

Easily dispense fine pitch components with ±25µm positioning accuracy.
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.