Partner Websites: ws-609 (Page 1 of 1)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

(Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609. The components were placed using the Universal Advantis machine. Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven. This oven had 14

Heller Industries Inc.

  1  

ws-609 searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Reflow Soldering 101 Training Course


Stencil Printing 101 Training Course
Void Free Reflow Soldering

Best Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications