Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
% of the other solder joints is visible. Figure 11 (bottom) shows an oblique view X-ray image of a BGA ball with 30% void. It also shows the interfaces of the solder joint as ellipses above and below the ball. Figure 11. X-ray Examination of Test Vehicle
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
% of the other solder joints is visible. Figure 11 (bottom) shows an oblique view X-ray image of a BGA ball with 30% void. It also shows the interfaces of the solder joint as ellipses above and below the ball. Figure 11. X-ray Examination of Test Vehicle
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/zh-CN/divisions/dage/x-ray-inspection
x-ray-inspection X-Ray Inspection and Test Products 公司 | 全球通讯录 | 语言 唯一部门 所有诺信公司 首页 产品 焊接强度测试仪 微材料测试仪 晶圆 X 射线计量 X 射线检测系统 测试类型 服务与支持 关于我们 Nordson DAGE 公司资料 ISO 认证 新闻 活动 工作机会 奖项 销售条款和条件 专利 联系方式 全球总部 Nordson DAGE 主页 系列X射线检测系统 Quadra 系列X射线检测系统的专利型
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/dage/x-ray-inspection
x-ray-inspection X-Ray Inspection and Test Products 会社 | グローバル ディレクトリ | 言語 部門のみ ノードソンの全て ホーム 製品 ボンドテスター マイクロ マテリアル試験装置 ウエハー X 線計測 X 線検査システム 試験の種類 サービスおよびサポート 会社概要 Nordson DAGE 企業プロファイル ISO 認定 ニュース イベント 仕事 受賞歴 販売条件 特許 連絡先 グローバル本社 Nordson DAGE ホーム
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/service-and-support/upgrade-programs/x-ray-upgrade-programs
X-ray Upgrade Programs X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
Heated Stage X-ray inspection X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/x-ray-inspection-systems/quadra-5-x-ray-inspection-system
Quadra 5 X-ray Inspektionssystem X-Ray Inspection and Test Products Corporate | Globale Standorte (Englisch) | Sprachen Nur Sparte Alles von Nordson Home Produkte Bondtest Systeme Mikro Werkstofftester Wafer Inspektion und Messung X-ray Inspektion X-ray
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/x-ray-inspection
, einschließlich BGA-, QFN- und IGBT-Bestückung, PTH-Füllung und fehlerhafter Bauteile bzw. Geräte. XD Series X-ray Inspektion Bewährte Röntgeninspektionssysteme
.png)
winsouce.jpg)