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3 bga non-reworkable underfill results

Industry Directory: bga non-reworkable underfill (Page 1 of 1)

Zymet, Inc

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.

Finetech

Industry Directory | Manufacturer

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.

Mid America (UK) Ltd

Industry Directory | Distributor

Formed in 1990, we supply SMT Splicing Tapes & SMT Adhesives. We are the exclusive European & USA distributor for Fuji Chemical Industrial Co Ltd, Japan.

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