Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Manufacturer's Representative
AlSi BondPads for PCB and Hybrid Packaging modules
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
Industry Directory | Manufacturer
Offering: Monodisperse spacer grade microspheres, used in bond line spacing of electronic displays, flip chip technology, optics mounting, filters, microscopy, and electronic equipment. Precision narrow size ranges.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Industry Directory | Manufacturer
Manufacturer of indium-based specialty metals and chemicals
Industry Directory | Manufacturer / Other
OEM Contract Manufacturer, Prototype production, battery testing, quick turn production, high/Low volume production. OEM products, complete box build, sub assembly, battery chargers, power supplies, microphones, cable and flex assembly.
Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
Industry Directory | Manufacturer
Development and manufacturing of X-ray based inspection systems.
