Industry Directory: bonding microelectronics (Page 1 of 2)

Inseto (UK) Ltd

Industry Directory |

Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.

Zymet, Inc

Industry Directory | Manufacturer

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.

Micro Hybrids, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Micro Hybrids offers true solutions for your hybrid micro circuit design, layout, production, testing and quality control needs.

AI Technology, Inc. (AIT)

Industry Directory | Manufacturer

Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.

MPIQC

Industry Directory | Manufacturer

MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.

Microtek, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

Winslow Automation (aka Six Sigma)

Industry Directory | Consultant / Service Provider

Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.

ROBOTHERM

Industry Directory | Manufacturer

ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.

Micralyne Inc.

Industry Directory | Manufacturer

Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.

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