Industry Directory: flipping (Page 1 of 6)

FlipChips Dot Com

Industry Directory |

A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.

Semiconductor Equipment

Industry Directory |

Semiconductor Equipment Corporation designs and manufactures flip chip placement and

WORLD Electronics

Industry Directory | Manufacturer

SMT,COB,FLIP CHIP,MCM Assembly. Prototype thru Production.

Compeq manufacturing co; LTD.

Industry Directory | Manufacturer's Representative

1-High layer count PCB manufacturer. 2-Flip chip plastic substrate manufacturer.

Waterfall Technologies

Industry Directory |

SMT Training programs , Hands-on Assembly line problem solving, yield improvement, consulting and process development. Flip Chip evaluation kits & Lab services

MeltroniX Inc

Industry Directory |

MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.

Kyocera America, Inc.

Industry Directory | Manufacturer

Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.

KSW Microtec

Industry Directory | Consultant / Service Provider

Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)

CASE Assembly Solutions Inc.

Industry Directory | Manufacturer

CASE is a full service electronics contract manufacturer specializing in multi layer double sided surface mount, micro BGA's, flip chip, csp, and the highest of technology. A company built on customer service. New Englands most well equipped facility

Express Manufacturing, Inc.

Industry Directory |

Global solutions for Electronics Manufacturing Services. 5 facilities featuring 17 Fuji & 16 Quad SMT lines, BGA & Micro BGA (Rework/2D X-ray), PTH, Flip Chip, COB, Prototype, ATE (Incircuit & Functional), Box Build, Fulfillment, DFM/DFT and Design.

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