We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
Industry Directory | Consultant / Service Provider
An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.
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