Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Manufacturer
We are offering EMS services,& We are one of the leading suppliers of soldering materials like Solder Sticks/Bars Pastes, IPA,& Soldering Fluxes,& Buyers of solder dross, cut leads and waste chemicals
Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Consultant / Service Provider / Manufacturer
An ISO 9002 and ISO 14001 certified company and one of the leading electronic manufacturing service providers in the Philippines.
Industry Directory | Manufacturer / Manufacturer's Representative
Hiflo Solders Private Ltd (HSPL) , was established in the early nineties and has grown into a business enterprise in manufacturing and marketing of Solders, Fluxes, Cleaners, Anodes, Soldering Accessories for the domestic & inte
Industry Directory | Manufacturer
Kewei Tin Industry Company, established in 2006, located in Shenzhen mainly focus on Solder Products R&D, provide solder wire/solder bar/solder paste/tin anode/tin balls/soldering flux etc...
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
