Industry Directory: packaging density (Page 1 of 2)

White Electronic Designs Corp.

Industry Directory | Manufacturer

Manufacture high-density memory and processor-based products, displays, interfaces

3M Electronics Materials Solutions Division

Industry Directory | Manufacturer

3M's Electronic Solutions Division designs, manufactures and markets a wide variety of electronic interconnect and protection products.

HDP User Group

Industry Directory | Association / Non-Profit

HDP User Group is a non-profit trade organization that offers memberships to companies involved in the supply chain of manufacturing products that utilize high-density electronic packages.

Dow Electronic Materials

Industry Directory | Manufacturer

DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.

Precision Circuits, Inc.

Industry Directory | Manufacturer

Precision Circuits, Inc. presenting PCB, Ltd. on PWB for special defense, space and high-tech applic

ASSY TECHNOLOGY CO.,LTD.

Industry Directory | Manufacturer

With over many years of PCB assembly experience, we can produce high-density PCBA such as a main-controlled board for electronics equipment, I/O Board for Robots, and PCBA for Smart Homes. ODM or OEM business are available.

AMTECH

Industry Directory | Manufacturer

Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.

Yamaichi Electronics

Industry Directory |

Yamaichi Electronics is an international manufacturer of Memory Card connectors, test & burn-in-sockets, production sockets, test contactors, and high-density connectors.

Nepes Corporation

Industry Directory | Manufacturer

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.

NxgenElectronics

Industry Directory | Other

All aspects of electronic interconnect solutions are available, including package and substrate design and lay-out, thermal analysis, high-speed simulation, process development, test engineering, and materials procurement. Technology assessment generally involves short turnaround times and consist of one or more of the following activities:

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