Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Contract electronics design and manufacturing service provider. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection, and automated conformal coating.
Industry Directory | Manufacturer
50K+ sq ft ESD safe plant, O'Hare area,PCB assembly, AeroSpace AS9100, Medical ISO 13485 and ISO 9001 certified, 01005, 0201, uBGA, PoP, QFN, DFN, CSP, QFP, TQFP placements. State-of-the-art equipment. Aluminum PCBA, Large Boards
Industry Directory | Manufacturer
Xeltek develops and manufactures universal Parallel, ISP, Production and Automated Device Programmers. Universal adapters support various package types such as PLCC, SOIC, SOP, TSOP, QFP, SDIP and uBGA.
Industry Directory | Manufacturer's Representative
Manufacturing Representative serving North Carolina, South Carolina, and Virginia.
Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.
Industry Directory | Consultant / Service Provider / Manufacturer
Full Service Electro Mechanical and Electronic Contract Assembly Services Provider
Industry Directory | Manufacturer
Electronic Assembly Solutions for high mix technology small to medium runs. Top quality with manufacturability engineering ingenuity.
Industry Directory | Manufacturer
FINE PITCH ASSEMBLY. SIMPLY BETTER AT WHAT WE DO.
SMt BGA Rework and Repair Equipment including Split Vision processes and lead free soldered product rework application. Thru-Hole Desoldering and Plating Equipment.
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