Technical Library: 0402 rework without pad (Page 1 of 1)

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

  1  

0402 rework without pad searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Stencil Printing 101 Training Course
Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

World's Best Reflow Oven Customizable for Unique Applications
Software for SMT

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...