Technical Library | 2021-02-20 00:55:47.0
Customers must be able to rely on accurate humidity indication as an assurance of SMD quality and fitness for processing and use. Without it, they might accept SMDs from suppliers that have already been irreparably damaged by moisture during storage or transit. Or, they might approve for processing SMDs that have been improperly or insufficiently heat-dried. Beyond the processing questions, there are financial questions: Where did the dry pack problems originate and who--supplier, customer, shipper--is financially responsible for the damaged SMDs? In response, Clariant, the originator of the color change humidity indicator card, and a member of the JEDEC's Subcommittee 14.1, "Reliability and Test Methods for Packaged Devices," created a new "non-reversible" halogen and cobalt dichloride free humidity indicator card. This HIC combines two reversible indicators (5% and 10%) with a new non-reversible (60% RH) indicator spot. (Figure 1) The 5% and 10% reversible spots work the way similar indicators do: they change color from blue (dry), to lavender, to pink (wet) to indicate humidity exposure at the indicated levels. If humidity levels drop, they will gradually revert back to blue.
Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2022-10-31 09:01:25.0
Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO
Technical Library | 2019-06-18 03:23:42.0
After-sale service Climatest Symor® strictly controls every production procedure,our main after-sale service procedure is as follow: 1) Email Climatest Symor® about the fault description(Pictures or video is preferred) 2) Within 1 working days, Climatest Symor® gives feedback or solution (If Climatest Symor® needs customer to take pictures about some parts of the machine, customer should cooperate accordingly to settle issues. 3) If checked that some parts(except glass nozzle) is possible broken by non-artificial reason, If necessary, customer deliver the broken part to Climatest Symor®, later Climatest Symor® send the repaired part or new part to customer. If unnecessary, Climatest Symor® will make delivery for the new part to customer directly. Remark:During warranty, Climatest Symor® is responsible for delivery fees both ways and parts fees.After warranty, Customer is responsible for the delivery fees both ways,Climatest Symor® will provide the parts to customer by cost price.
Technical Library | 2021-06-07 19:10:16.0
The aim of this study was to compare leaching characteristics of metals from printed circuit boards (PCBs), taken from waste electrical and electronic equipment in the presence and in the absence of the iron-oxidizing bacteria, Acidithiobacillus ferrooxidans. A. ferrooxidans not only increases the leached concentration of Cu from the PCBs, but also inhibits the components of the 0K medium and leached Cu from forming precipitates such as libethenite (Cu2(PO4)(OH)), thereby assisting Cu recovery from the PCBs. In addition, the leached concentration of Pb from PCBs decreased in the presence of A. ferrooxidans, due to Pb forming amorphous precipitates. It is expected that Pb is not highly toxic to A. ferrooxidans. Consequently, A. ferrooxidans can be used as a cost-effective and environmentally friendly way to leach out valuable metals from PCBs as low-grade urban ore.
Technical Library | 2017-10-19 01:17:56.0
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Technical Library | 2019-05-06 23:13:09.0
Temperature and humidity test chamber has brought a lot of help to many industrial enterprises, but while it brings convenience to us, we should also take good care of them, otherwise they may be brought into the end-of-life phase ahead of time. The way of maintenance is also very simple. After daily use, the equipment is cleaned regularly, but the cleaning of the test chamber is also very skillful. If the operation is wrong, it may also lead to equipment failure. Let‘s learn how to extend the service life of the temperature and humidity test box together. 1, Pls clean the working room with water after each use, then dry the interior with dry cotton cloth. 2, Pls regularly remove dust from the evaporator inside the equipment, and periodically wipe the equipment to ensure clean and tidy. 3, When doing the test, the sample should be uniformly placed onto sample shelves,and the vent should not be blocked to prevent the influence of the test 4, It is necessary to pay attention to the cleaning of water tanks in peacetime, after the test or when the equipment is not intended to be used for a long time, all the water in the tank should be discharged, otherwise it will lead to the formation of scale inside the tank. The water used in the temperature and humidity test chamber must be pure or distilled water, or long-term use may result in a humidifier or internal pipe clogging. Above are the usual use notice of temperature and humidity test chamber, if customer adhere to the above several points,it is really able to prolong the service life of the equipment.
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