Technical Library | 2000-11-13 20:45:03.0
Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Technical Library | 2023-08-14 20:45:11.0
The partnership of Design and Manufacturing is central to the process of bringing a product to market. The impact of problems in either of these stages can increase exponentially if they go unnoticed until after the product reaches the customer. Overstress Test (tests using stresses beyond the design limit of the product) is successful at uncovering such faults in both product design and the manufacturing process and insures the overall robustness of the product. The benefits of Overstress Test include ...
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