Technical Library | 2015-08-17 09:07:11.0
Since a high percentage of product failures can be traced to poor electrical connections, crimp quality is of paramount importance. There are many factors that come into play that affect crimp quality and knowing the relevant factors, and to what extent each factor affects the end result, will help to guide the process engineer towards achieving the best possible results.
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.
Technical Library | 2015-04-29 03:29:56.0
Statistical Appearance Modelling technology enables an AOI system to “learn real world variation” based on operator interaction with inspection task results. This provides an accurate statistical description of normal variation in a product. With modelling technology, the user does not have to anticipate potential defects as the system will “flag” anything outside the “normal production range”. And, since the system is programmed with real production variation, it is sensitive to small subtle changes enabling reliable defect detection. Autonomous prediction of process variation enables an AOI system to be set up from a single PCB with production-ready performance. Setup time can be
Technical Library | 2015-04-03 20:02:31.0
Understanding your process and how to minimize defects has always been important. Nowadays, its importance is increasing with the complexity of products and the customers demand for higher quality. Quality Management Solutions (QMS) that integrate real-time test and inspection results with engineering and production data, can allow the optimization of the entire manufacturing process. We will describe the cost and time benefits of a QMS system when integrated with engineering data and manufacturing processes. We will use real examples that can be derived from integrating this data. This paper also discusses the aspects of Quality Management Software that enables electronic manufacturers to efficiently deliver products while achieving higher quality, reduce manufacturing costs and cutting repair time. Key words: Quality Management Software, ICT, Repair workstations, First Pass Yield, Pareto analysis, Flying Probe, QMS.
Technical Library | 2015-07-21 13:50:37.0
Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
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