Technical Library: allowing (Page 3 of 9)

Test Solution for Heatsinks in Power Electronics Applications

Technical Library | 2021-03-24 01:30:47.0

Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover ...

Politecnico di Torino

Microbial Nanocellulose Printed Circuit Boards for Medical Sensing

Technical Library | 2021-04-01 14:40:08.0

We demonstrate the viability of using ultra-thin sheets of microbially grown nanocellulose to build functional medical sensors. Microbially grown nanocellulose is an interesting alternative to plastics, as it is hydrophilic, biocompatible, porous, and hydrogen bonding, thereby allowing the potential development of new application routes. Exploiting

U.S. Naval Research Laboratory

A Flexible Front-End for Wearable Electrochemical Sensing

Technical Library | 2022-01-19 17:06:16.0

This work presents the design and the realization of a flexible front-end circuitry for electrochemical sensing with wearable devices. The hardware combines readout circuitry for amperometric and Open Circuit Potential (OCP) measurements. The sensing platforms are dedicated to lactate and lithium detection in sweat, hence allowing the monitoring of athletes under physical effort.

Swiss Federal Institute of Technology Lausanne - Integrated Systems Laboratory (Laboratoire des Systèmes Intégrés – LSI)

Selective Soldering: A need for Innovation and Development

Technical Library | 2023-12-18 21:07:29.0

Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board. Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here. Hand-load selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.

Pillarhouse International Ltd.

QPlan - NPI Tools included

Technical Library | 2018-10-29 05:03:59.0

We found that NPI process of SMT is mostly similar and sometimes overlapping to tooling process. In addition, in most cases the programmer is part of the team working on the NPI process. So, QPlan was extended with NPI Tools as a part of tooling process. This allows the team to carry out the NPI process at offline. And at the end of it, they can create corrected SMT program at zero time.

Proventus Technologies

Implementation of a High-Quality Dolby* Digital Decoder Using MMX™ Technology

Technical Library | 1999-05-07 10:23:43.0

Software decoding of Dolby Digital allows it to become a baseline capability on the PC, with greater flexibility than a hardware approach. Intel's MMX™ technology provides instructions that can significantly speed up the execution of the Dolby Digital decoder, freeing up the processor to perform other tasks such as video decoding and/or audio enhancement. Intel has worked closely with Dolby Laboratories to define an implementation of Dolby Digital based on MMX technology that has achieved Dolby's certification of quality.

Intel Corporation

Large Thin Organic PTFE Substrates for Multichip Applications

Technical Library | 2007-06-13 13:44:10.0

Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp.

i3 Electronics

Optimizing Thermal and Mechanical Performance in PCBs

Technical Library | 2008-02-04 12:13:38.0

Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.

Stablcor

5 Axis Fluid Dispensing

Technical Library | 2015-07-31 16:28:16.0

Technology is in constant change and circuit assembly is no different. It is becoming more and more advanced as needs change and demands for more capabilities increase. In order to meet these demands, equipment manufacturers are integrating the latest innovations and tools to serve the industry. The need to better protect printed circuit assemblies from harsh environments using automated selective conformal coating is becoming a must. 5 axis fluid dispensing allows conformal coating to be applied to printed circuit assemblies like never before.

ETS - Energy Technology Systems, Inc.

What Is Turnkey Electronic Manufacturing?

Technical Library | 2017-06-23 12:42:59.0

End-to-end PCB assembly by world-class companies like Power Design Services allows you to focus on your core competencies with the added benefits of reduced cost and time to market. From material procurement to circuit board design and manufacturing, and supply chain management, we serve your needs helping you reach customers faster. Here is an overview of what our turnkey electronic manufacturing services consist of, and how you can use them to reduce your build time and cost.

Power Design Services


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Voidless Reflow Soldering

High Resolution Fast Speed Industrial Cameras.
consignment program

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Handling Machine with CE

High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications


SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...