Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
Technical Library | 2019-04-11 06:04:49.0
With the development of science and technology, the climatic chamber quality has been improved, and the failure rate is reduced, but there still have the failure probability.today we introduce what are the mian factors for big noise high low temperature test chamber: 1.External factors: the bottom angle is uneven, the ground is uneven, adjust the bottom angle, ensure the equipment is in a horizontal position; 2.The equipment is touched other objects or pushed against the wall,pls remove the objects and keep a certain distance from the wall. 3.Compressor noise:check whether the compressor collides with the pipeline,and evaporator dish is loose or not. 4.Check whether compressor shock absorbers are aging and replace them. 5.Solenoid valve noise: solenoid valve reversing caue loud sound, pls add damping glue, if no effect, need to replace solenoid valve. If there is AC noise, need to replace the power board. 6.Check wether the fan or the fan string shaft make noise,whether the fan blades are touched and deformed, whether the fan is fixed or not, pls adjust accordingly or add the rubber pad. If further technical questions,contact us without hesitation!---Climtest Symor® technical team
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Technical Library | 2019-04-18 21:53:04.0
IPX9K Rain Spray Test Chamber(high Pressure high temperature water jet) simulates the use of pressure washer steam cleaning onto the enclosure, It is recognised as the harshest of all ingress protection tests. However the requirement is becoming more prevalent across many industries. Test method for IPX9K : Make sure the water temperature inside the water tank +80°C, water flow rate with 14L-16L per min, water pressure: 8000 Kpa -10000 Kpa (80–100 bar) at distance of 100mm~ 150mm, The test duration is 30 seconds in each of 4 angles, total spray testing time is 2 minutes. IPX9 rain test chamber applicable standards: IEC 60529 – Degrees of protection provided by enclosures (IP Code).Here is working principle in picture.
Technical Library | 2021-03-04 15:16:27.0
Out-of-plane wrinkling has a significant influence on the mechanical performance of composite laminates. Numerical simulations were conducted to investigate the progressive failure behavior of fiber-reinforced composite laminates with out-of-plane wrinkle defects subjected to axial compression. To describe the material degradation, a three-dimensional elastoplastic damage model with four damage modes (i.e., fiber tensile failure, matrix failure, fiber kinking/splitting, and delamination) was developed based on the LaRC05 criterion. To improve the computational efficiency in searching for the fracture angle in the matrix failure analysis, a high-efficiency and robust modified algorithm that combines the golden section search method with an inverse interpolation based on an existing study is proposed.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
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