Technical Library: bga and crack and xray (Page 1 of 1)

Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies

Technical Library | 2017-06-22 17:11:53.0

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.

Jet Propulsion Laboratory

Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis

Technical Library | 2023-11-20 18:49:11.0

Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide.

Nordson DAGE

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Technical Library | 2010-09-16 18:45:06.0

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de

Nordson DAGE

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