Technical Library: common parts (Page 1 of 1)

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Technical Library | 2015-08-27 15:32:16.0

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.

BEST Inc.

Siemens Asm Pickup Window 12x16 Smt Spare Parts 00322753S04 00328503

Technical Library | 2022-10-31 08:43:27.0

Model/Specification: 12*16MM Common Name: Press Cover/GUIDE Suitable Fo: Siemens Feeder Parts Material: Ceramic Wight: 55g Quality: 100% Tested High Light: 12x16 Smt Spare Parts, 00328503, 00322753S04

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Conformal Coating Defects

Technical Library | 2023-07-04 17:31:22.0

Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating.

Diamond MT

iNEMI Pb-Free Alloy Characterization Project Report: Part II - Thermal Fatigue Results For Two Common Temperature Cycles

Technical Library | 2021-09-08 14:10:12.0

The Pb-Free Alloy Characterization Program sponsored by International Electronics Manufacturing Initiative (iNEMI) is conducting an extensive investigation using accelerated temperature cycling (ATC) to evaluate ball grid array (BGA) thermal fatigue performance of 12 commercial or developmental Sn based Pb-free solder alloys. This paper presents the initial findings from a specific subset of the temperature cycling test matrix. The focus is on comparing alloy performance for two of the most commonly specified temperature cycles, 0 to 100 °C and -40 to 125 °C.

iNEMI (International Electronics Manufacturing Initiative)

Inventory Efficiency In The Supply Chain

Technical Library | 2001-05-23 16:23:26.0

Lowering inventories is one of the quickest ways to decrease working capital needs. Performance measurements, such as the old standby ROA (return on assets) and the newer EVA (economic value added), as well as other measures that gauge how efficiently capital is used, have become more common organizational drivers. In fact, many an executive’s bonus depends, at least in part, on how efficiently capital is used.

R. Michael Donovan & Co., Inc.

How to choose the material of PCB ?

Technical Library | 2019-12-30 02:09:39.0

How to choose the material of PCB ? The choice of PCB material must meet the design requirements, the quality of production and cost need to achieve a balance. The design requirements include electrical and institutional parts. This material problem is usually important when designing very high speed PCB boards (frequencies greater than GHz). For example, the commonly used FR-4 material may not be used when dielectric loss at several GHz frequencies, which can have a significant effect on signal attenuation . In the case of electrical, it is important to note whether the dielectric constant and the dielectric loss are combined at the designed frequency

PCBONLINE

PCB Surface Finishes: A General Review

Technical Library | 2015-06-22 16:39:47.0

Surface finishing is an integral part of any PCB fabrication. It is generally applied to exposed Cu connectors and conductors on the board. Surface finishing has numerous important functions. It serves as a protective layer for the Cu connectors during storage. The surface finish helps minimize or reduce tarnish of the Cu substrate. Additionally, since it is the layer that comes into contact with other components during assembly, it ensures good solderability between the PCB and the component during assembly. Furthermore after assembly, the finish helps prolong the integrity of the solder joint during use. A general review of common PCB surface finishes is presented. The advantages and disadvantages of each are discussed and compared.

MacDermid Inc.

Common Process Defect Identification of QFN Packages

Technical Library | 2019-07-23 22:33:47.0

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.

Nordson DAGE

Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies

Technical Library | 2018-04-11 22:18:05.0

Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz, 77 GHz and many other mmWave frequencies. When designing a PCB for mmWave frequency, the properties of the circuit materials need to be considered since they can be critical to the success of the application. Understanding the properties of circuit materials at these frequencies is very important.This paper will give an overview of which circuit material properties are important to mmWave frequency applications using PCBs. There will be data supplied which demonstrates why these properties are essential to the circuit material selection for mmWave applications. Some properties discussed will be dielectric constant (Dk) control, dissipation factor, moisture absorption, thickness control and TCDk (Temperature Coefficient of Dk). Measured comparisons will be shown for insertion loss and Dk versus frequency for different types of circuit materials up to 110 GHz. As part of the test data, the impact on circuit performance due to TCDk and moisture absorption will be shown at mmWave frequencies.

Rogers Corporation

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Technical Library | 2022-06-27 16:50:26.0

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.

Institute of Electrical and Electronics Engineers (IEEE)

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