Technical Library | 2023-11-20 17:30:11.0
Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection
Technical Library | 2009-09-18 14:52:06.0
Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
Technical Library | 2020-01-02 12:16:02.0
A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren't discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually!
Technical Library | 2021-02-17 22:13:39.0
The development of various biosensors has revolutionized the healthcare industry by providing rapid and reliable detection capability. Printed circuit board (PCB) technology has a well-established industry widely available around the world. In addition to electronics, this technology has been utilized to fabricate electrical parts, including electrodes for different biological and chemical sensors. High reproducibility achieved through long-lasting standard processes and low-cost resulting from an abundance of competitive manufacturing services makes this fabrication method a prime candidate for patterning electrodes and electrical parts of biosensors. The adoption of this approach in the fabrication of sensing platforms facilitates the integration of electronics and microfluidics with biosensors. In this review paper, the underlying principles and advances of printed board circuit technology are discussed. In addition, an overview of recent advancements in the development of PCB-based biosensors is provided. Finally, the challenges and outlook of PCB-based sensors are elaborated. doi:10.3390/bios10110159
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Technical Library | 2012-03-15 17:50:28.0
The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their
Technical Library | 2009-09-16 15:13:58.0
The dispensing industry within electronics manufacturing represents a very diverse marketplace indeed; many different materials can be applied in many different ways. One high-growth area in this market is underfill, driven by the explosive demand for hand-held devices (HHDs). This segment is comprised of popular consumer goods, such as cell phones, mp3 players, GPS navigators, PDAs, portable games and ultra-mobile PCs. A new, non-contact dispense technology, known as Streaming, has recently been introduced to specifically address the incumbent needs associated with underfill.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
