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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Technical Library | 2012-10-18 21:58:51.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.

Agilent Technologies, Inc.

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