Technical Library: cp and 40 (Page 1 of 2)

Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems

Technical Library | 2013-11-14 10:43:40.0

Understanding accuracy and repeatability is an important step to analyze fluid dispensing system performance. They can also be prone to misinterpretation when reviewing a product specification. A dispensing motion system can be made to perform better or worse under different operating conditions. This article will explain accuracy and repeatability, and how they can be applied to different specifications. It will also discuss key considerations when interpreting accuracy and repeatability for decision making.

ASYMTEK Products | Nordson Electronics Solutions

SMT Intelligent Solder Paste Supply System: The Smart Solution for Precise and Consistent SMT Paste Printing

Technical Library | 2023-09-18 03:40:02.0

Our SMT intelligent solder paste supply system is the perfect solution for businesses that need to improve the accuracy and consistency of their SMT paste printing. Our system uses the latest technology to automatically dispense the correct amount of solder paste to each stencil opening, ensuring that your SMT assemblies are consistently high-quality.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

A Theoretical Framework for Industry 4.0 and Its Implementation with Selected Practical Schedules

Technical Library | 2021-06-02 19:34:48.0

In recent years, there has been dynamic changes in the industrial environment as a result of further innovations called Industry 4.0 (I.4.0), especially in the field of digital technology and manufacturing. Despite numerous examples of the implementation of Industry 4.0 in enterprises, there is no general framework for the implementation of Industry 4.0 with a detailed schedule. Researching the ways of implementing Industry 4.0 is still a current and unexplored area of research. The main aim of the paper is to present the concept of the theoretical framework for Industry 4.0 implementation based on selected schedules of the Industry 4.0 implementation. The paper was based on information from literature review and analysis of pilot enterprise projects to Industry 4.0 (case study) that were conducted in selected enterprises. The paper presents the key components of the framework of Industry 4.0 and the basic stage of implementing the concept in the enterprises, paying attention to their sequence and time frames. The proposed approach is dedicated to researchers and practitioners who implement the concept of Industry 4.0 in enterprises

Silesian University of Technology

Conformal Coating Why, What, When, and How

Technical Library | 2012-01-05 18:40:07.0

Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre

DfR Solutions (acquired by ANSYS Inc)

Making the Move from Machine Monitoring to SMART Manufacturing and the Implications on Profiling Systems

Technical Library | 2016-09-12 10:16:04.0

It is hard to open an Industry newsletter or visit an equipment manufacturer’s website without coming across a mention of the Internet of Things (IoT), Industry 4.0, SMART Manufacturing or ‘big data’. The accessibility to obtain data will only increase and this information and its real-time processing will become one of the most important resources for companies in the future. Production machinery will no longer simply processes the product, but the product will communicate with the machinery to tell it exactly what to do. Industry 4.0 has the vision to connects embedded system technologies and SMART production processes to drastically transform industry and production giving way to the SMART factory development. Future development in oven technology will allow machines to be controlled more intelligently and remotely resulting in the lowest cost model for manufacturing flow.

Solderstar

Basics of Encoder and Orthogonal Coding

Technical Library | 2021-12-07 00:57:40.0

Encoder is a kind of electromechanical equipment, which can be used to measure the movement of machinery or the target position of machinery. Most encoders use optical sensors to provide electrical signals in the form of pulse sequences, which can be converted into motion, direction or position information in turn.

OKmarts Industrial Parts Mall

A Compliant and Creep Resistant SAC-Al(Ni) Alloy

Technical Library | 2009-03-27 22:22:40.0

The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc

Indium Corporation

Paper Substrates and Inks for Printed Electronics

Technical Library | 2023-03-13 19:40:21.0

The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates.

Western Michigan University

Vapor Phase Technology and its Application

Technical Library | 2013-03-27 23:43:40.0

Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.

A-Tek Systems Group LLC

MEMS Products PCB Design, Mounting, and Handling Guidelines - ICM-40xxx, ICM-42xxx, ICM-43xxx, and ICM-45xxx

Technical Library | 2023-10-09 16:10:02.0

This document provides high-level PCB design, sensor mounting, and handling guidelines for TDK IMU devices, which incorporate a combination of gyroscopes and accelerometers. Each sensor has specific requirements to ensure the highest performance in a finished product. For a layout assessment of your design, including placement and estimated temperature disturbances, please contact TDK. The TDK IMU devices discussed in this document (ICM-40607x, ICM-40608, ICM-42xxx, ICM-43xxx, and ICM-45xxx products) consist of 3-axis MEMS gyroscopes and 3-axis MEMS accelerometers.

TDK - Lambda Americas

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