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Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Technical Library | 2012-01-12 22:51:19.0

In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi

Lamar University - Department of Mechanical Engineering

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