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A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Technical Library | 2007-12-13 17:03:02.0

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.

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