Technical Library: detection sensor (Page 1 of 2)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

IST AG - Focus on Flow Sensors

Technical Library | 2017-04-20 19:16:17.0

IST AG thin film mass flow sensors offer solutions for a wide variety of flow applications. The thin film and membrane technologies incorporate highly accurate temperature sensors and heaters as core elements of the sensors. IST AGs flow sensors are applicable in gas (liquids upon request), have an operating temperature range of -30 °C to +450 °C, and can measure low rate and direction from 0.0001 m/s (microflowSens) to 100 m/s (respectively from 1 mL/min to 10 L/min). In addition to measuring flow rates, our sensors can detect the presence of a liquid, biofilm or bubbles as well as indicate liquid level. Development channels guarantee the best possible adaptation of our sensors, whether in terms of dynamic range, response time, directional detection or ambient conditions.

Innovative Sensor Technology, USA Division

Pad Cratering Susceptibility Testing with Acoustic Emission

Technical Library | 2015-08-13 15:52:40.0

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.

Agilent Technologies, Inc.

Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing

Technical Library | 2020-10-08 00:55:22.0

This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.

Stanford University

Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms

Technical Library | 2021-02-17 22:13:39.0

The development of various biosensors has revolutionized the healthcare industry by providing rapid and reliable detection capability. Printed circuit board (PCB) technology has a well-established industry widely available around the world. In addition to electronics, this technology has been utilized to fabricate electrical parts, including electrodes for different biological and chemical sensors. High reproducibility achieved through long-lasting standard processes and low-cost resulting from an abundance of competitive manufacturing services makes this fabrication method a prime candidate for patterning electrodes and electrical parts of biosensors. The adoption of this approach in the fabrication of sensing platforms facilitates the integration of electronics and microfluidics with biosensors. In this review paper, the underlying principles and advances of printed board circuit technology are discussed. In addition, an overview of recent advancements in the development of PCB-based biosensors is provided. Finally, the challenges and outlook of PCB-based sensors are elaborated. doi:10.3390/bios10110159

Louisiana State University

Bare PCB Inspection By Mean Of ECT Technique With Spin-Valve GMR Sensor

Technical Library | 2021-05-06 13:45:49.0

The high-sensitive micro eddy-current testing (ECT) probe composed of planar meander coil as an exciter and spin-valve giant magneto-resistance (SV-GMR) sensor as a magnetic sensor for bare printed circuit board (PCB) inspection is proposed in this paper. The high-sensitive micro ECT probe detects the magnetic field distribution on the bare PCB and the image processing technique analyzes output signal achieved from the ECT probe to exhibit and to identify the defects occurred on the PCB conductor. The inspection results of the bare PCB model show that the proposed ECT probe with the image processing technique can be applied to bare PCB inspection. Furthermore, the signal variations are investigated to prove the possibility of applying the proposed ECT probe to inspect the high-density PCB that PCB conductor width and gap are less than 100 μm.

Kanazawa University, ,

Industry 4.0: Mining Physical Defects in Production of Surface-Mount Devices

Technical Library | 2021-12-02 01:44:00.0

With the advent of Industry 4.0, production processes have been endowed with intelligent cyber-physical systems generating massive amounts of streaming sensor data. Internet of Things technologies have enabled capturing, managing, and processing production data at a large scale in order to utilize this data as an asset for the optimization of production processes. In this work, we focus on the automatic detection of physical defects in the production of surfacemount devices. We show how to build a classification model based on random forests that efficiently detects defect products with a high degree of precision. In fact, the results of our preliminary experimental analysis indicate that our approach is able to correctly determine defects in a simulated production environment of surface-mount devices with a MCC score of 0.96. We investigate the feasibility of utilizing this approach in realistic settings. We believe that our approach will help to advance the production of surface-mount devices.

Fraunhofer Institute for Applied Information Technology

Electrochemical Sensors For Nitrogen Species: A Review

Technical Library | 2021-02-17 22:41:48.0

This review provides an overview of electrochemical sensors for nitrogen species, especially, ammonium, nitrate, and nitrite. Due to the extensive anthropogenic activities, the concentration of nitrogen species has been dramatically increased in the environment. In particular, fertilizers containing ammonium and nitrate have been extensively used in agriculture where as nitrite-included additives or preservatives have been used in food industry. Since excessive nitrogen species have an adverse effect to environment and human health such as eutrophication and methemoglobinemia (blue baby syndrome), efforts have been made to develop efficient monitoring methods. On that account, the U.S Environmental Protection Agency (EPA) established the maximum contaminant level (MCL) for nitrate and nitrite to be 10mg/L nitrate-N and 1mg/L nitrite-N in drinking water, respectively. Typical analytical methods for nitrogen species are chromatography or spectrometry. However, these methods require expensive instrumentations, skilled operator, and considerable sample pretreatment and analysis time. As an alternative approach, electrochemical sensors have been explored to monitor nitrogen species owing to its simplicity, superior sensitivity, versatility, rapidity, field applicability, and selectivity. In this review, electrochemical based detection methods for nitrogen species especially ammonium, nitrate and nitrite are systematically discussed, including the fundamentals of electrochemical techniques, sensing mechanisms, and the performance of each sensor. doi.org/10.1016/j.snr.2020.100022

University of Connecticut

Soft, Wireless Periocular Wearable Electronics For Real-Time Detection Of Eye Vergence In A Virtual Reality Toward Mobile Eye Therapies

Technical Library | 2020-07-22 19:24:33.0

Recent advancements in electronic packaging and image processing techniques have opened the possibility for optics-based portable eye tracking approaches, but technical and safety hurdles limit safe implementation toward wearable applications. Here, we introduce a fully wearable, wireless soft electronic system that offers a portable, highly sensitive tracking of eye movements (vergence) via the combination of skin-conformal sensors and a virtual reality system. Advancement of material processing and printing technologies based on aerosol jet printing enables reliable manufacturing of skin-like sensors, while the flexible hybrid circuit based on elastomer and chip integration allows comfortable integration with a user's head. Analytical and computational study of a data classification algorithm provides a highly accurate tool for real-time detection and classification of ocular motions. In vivo demonstration with 14 human subjects captures the potential of the wearable electronics as a portable therapy system, whose minimized form factor facilitates seamless interplay with traditional wearable hardware.

Georgia Institute of Technology

Inkjet-Printed and Paper-Based Electrochemical Sensors

Technical Library | 2018-07-03 12:27:02.0

It is becoming increasingly more important to provide a low-cost point-of-care diagnostic device with the ability to detect and monitor various biological and chemical compounds. Traditional laboratories can be time-consuming and very costly. Through the combination of well-established materials and fabrication methods, it is possible to produce devices that meet the needs of many patients, healthcare and medical professionals, and environmental specialists. Existing research has demonstrated that inkjet-printed and paper-based electrochemical sensors are suitable for this application due to advantages provided by the carefully selected materials and fabrication method. Inkjet printing provides a low cost fabrication method with incredible control over the material deposition process, while paper-based substrates enable pump-free microfluidic devices due to their natural wicking ability. Furthermore, electrochemical sensing is incredibly selective and provides accurate and repeatable quantitative results without expensive measurement equipment. By merging each of these favorable techniques and materials and continuing to innovate, the production of low-cost point-of-care sensors is certainly within reach

Louisiana State University

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detection sensor searches for Companies, Equipment, Machines, Suppliers & Information

ISVI - Industrial Sensor Vision International Corporation
ISVI - Industrial Sensor Vision International Corporation

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Manufacturer

3 Morse Road 2A
Oxford, CT USA

Phone: +1 203 592 8723