Technical Library | 1999-08-05 10:27:43.0
This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included.
Technical Library | 2018-08-01 11:25:59.0
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essential to have a good 'Design for Test' (DFT) to ensure a robust structural test. (...)During the course of the DFT review, can we realize a good test strategy for the PCBA. How can the test strategy of the PCBA be partitioned as to what portions of the design can be covered structurally and what is covered functionally, in a way that provides best diagnostics to discover faults
Technical Library | 2013-02-14 12:54:29.0
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults, such as solder shorts and opens. Today's advanced IC technology now includes high-speed differential interfaces that include AC or DC coupling components loaded on the printed circuit assembly. Simple stuck-at-high/low test methods are not sufficient to detect all assembly fault conditions, which includes shorts, opens and missing components. Improved diagnostics requires detailed circuit analysis, predictive assembly fault simulation and more complex testing to isolate and accurately detect all possible assembly faults... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2020-11-19 20:35:26.0
Simultaneously with the first complex electronic circuits, the task of creating effective means of diagnosing and repairing them appeared. In previous decades, specialized programmable stands were used for diagnostics of serial electronic products, as well as various testers and probes for troubleshooting during their operation. But the dramatic increase in the density / cost factor, in parallel with the very rapid modification of electronic products, made programmable stands economically ineffective even in mass production. The use of traditional laboratory equipment (oscilloscopes, multimeters, etc.) requires power supply to the defective modules, which is often impossible and unsafe, since it can lead to failure of the working modules of the module. In addition, the use of this equipment requires documentation and highly qualified personnel. More automated and sophisticated signature analysis systems came to the rescue in solving this problem. A feature of these devices is that they allow you to test digital and analog assemblies without dismantling components and without supplying voltage.
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