Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2023-09-18 03:53:42.0
好的，以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题： SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2019-07-27 07:13:16.0
Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.
Technical Library | 2018-05-05 21:37:12.0
With the growing demand for manufacturing facilities, authorities took many actions to escalate the efficiency of production processes. Many formal methods were implemented for a longer period of time without acquiring significant growth in the field. But with the introduction of Autonomous Maintenance (AM) to the modern manufacturing facilities they achieved an increment in efficiency and productivity in a historical brisk pace. This article is about AM Step Zero too.
Technical Library | 2021-07-27 14:49:16.0
Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) that are exposed to high humidity and voltage gradients, has caused catastrophic field failures. CAF is an electrochemical migration failure mechanism in PWBs. In this article, we discuss CAF, the factors that enhance it, and the necessary conditions for its occurrence. Published studies are discussed, and the results of historical mean time to failure models are summarized. Potential reasons for CAF enhancement solutions are discussed, and possible directions in which to develop anti-CAF materials are proposed.
Technical Library | 2021-09-07 08:21:37.0
Utsource grows from a child to an adult serving the global 30W + customers. UTSOURCE.net is a professional purchasing B2B & B2C tools in electronic components field. UTSOURCE.net provides different types such as IC, Modules, RF transistors etc., and various product type's PDF parameter form as well as the related photographs, we also provide satisfying one-stop package service for customers. We fell honored to serve the global 30W + customers.We spent 15 years touching the needs of customers from all over the world.So we know better that our customers need their packages to arrive safely.After-sales service need at your fingertips and intimate service should be to customers' satisfaction
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2018-02-01 00:31:48.0
This paper briefly summarizes the technologies underpinning the evolution in electrical system diagnosis and repair, which include schematic layout automation using prototypes and rule-based styling, instant language translation, 2D/3D view links with schematics, interactive diagnostic procedures, and dynamically-generated signal-tracing diagrams. These technologies empower after-sales service teams with state-of-the-art capabilities, which not only reduce costs but also improve brand quality in the eyes of its customers.
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