Technical Library: fr-4 (Page 1 of 2)

Solder Paste Dispensing For Aerospace and Defense

Technical Library | 2023-08-16 18:16:05.0

A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.

GPD Global

Can You Laser Cut FR4?

Technical Library | 2024-07-29 18:36:45.0

A review of how FR4 is laser and for applications.

A-Laser, Inc.

Can You Laser Cut FR4?

Technical Library | 2024-10-29 15:57:34.0

Reviews the laser technology used for cutting FR4 material

A-Laser, Inc.

PCBONLINE rigid capability

Technical Library | 2019-12-30 02:11:05.0

(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers

PCBONLINE

Can You Laser Cut FR4?

Technical Library | 2024-08-26 16:47:48.0

Laser Technology being used to cut FR4 material and what are the applications of.

A-Laser, Inc.

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Technical Library | 2012-08-23 21:06:35.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res

Albemarle Corporation

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Technical Library | 2012-09-20 21:45:38.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin

Agilent Technologies, Inc.

High Performance Multilayer PCBs Design and Manufacturability

Technical Library | 2013-10-31 17:36:41.0

Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations.

Spectrum Integrity, Inc.

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Technical Library | 2017-02-16 16:53:49.0

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.

Auburn University

How to choose the material of PCB ?

Technical Library | 2019-12-30 02:09:39.0

How to choose the material of PCB ? The choice of PCB material must meet the design requirements, the quality of production and cost need to achieve a balance. The design requirements include electrical and institutional parts. This material problem is usually important when designing very high speed PCB boards (frequencies greater than GHz). For example, the commonly used FR-4 material may not be used when dielectric loss at several GHz frequencies, which can have a significant effect on signal attenuation . In the case of electrical, it is important to note whether the dielectric constant and the dielectric loss are combined at the designed frequency

PCBONLINE

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