Technical Library: hs 50 displaced components (Page 1 of 1)

The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.

Technical Library | 2008-04-29 15:50:45.0

The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies

Rockwell Collins

  1  

hs 50 displaced components searches for Companies, Equipment, Machines, Suppliers & Information

IPC Training & Certification - Blackfox

Software for SMT placement & AOI - Free Download.
PCB Handling with CE

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Hot selling SMT spare parts and professional SMT machine solutions

BEST IPC Certifications and Solder Training Online!