Technical Library | 2014-03-27 14:50:01.0
Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices.
Technical Library | 2015-05-11 21:27:52.0
Originating from the last millenium, almost three decades ago, the introduction of surface mount packaging triggered a wave of changes throughout many aspects of electronics production. A small number of talented, innovative test engineers from various big players of the industry started to attend meetings to discuss the impact of that change of technology on their future test concepts for modern assemblies. The Joint Test Action Group was born.
Technical Library | 2015-07-31 16:28:16.0
Technology is in constant change and circuit assembly is no different. It is becoming more and more advanced as needs change and demands for more capabilities increase. In order to meet these demands, equipment manufacturers are integrating the latest innovations and tools to serve the industry. The need to better protect printed circuit assemblies from harsh environments using automated selective conformal coating is becoming a must. 5 axis fluid dispensing allows conformal coating to be applied to printed circuit assemblies like never before.
Technical Library | 2017-06-08 17:31:23.0
Recently, there has been an upsurge in efforts dedicated to developing low-cost flexible electronics by exploiting innovative materials and direct printing technologies. This interest is motivated by the need for low-cost mass-production, shapeable, and disposable devices, and the rapid prototyping of electronics and sensors. This review, following a short overview of main printing processes, reports examples of the development of flexible transducers through low-cost inkjet printing technology.
Technical Library | 2019-04-04 15:39:49.0
Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics. Building on the successful enterprise-level platform for integrated circuit (IC) manufacturing, this powerful, configurable and scalable MES solution enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.
Technical Library | 2020-06-10 01:42:55.0
Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.
Technical Library | 2022-01-12 19:17:37.0
Occasionally, mature industries are turned upside down by innovations. The years of research on robotics and multiagent systems are coming together to provide just such a disruption to the material-handling industry. While autonomous guided vehicles (AGVs) have been used to move material within warehouses since the 1950s, they have been used primarily to transport very large, very heavy objects like rolls of uncut paper or engine blocks.
Technical Library | 2022-02-16 15:34:32.0
Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices
Technical Library | 2010-10-07 20:20:58.0
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin
Technical Library | 2017-09-27 18:46:58.0
Flex and rigid flex circuits have become increasingly popular in the high-density electronics industry for their cost-saving three-dimensional configurations. The ability to build circuitry to fit the device instead of the other way around, offers significant advantages for complex aerospace, military, and medical device applications.
