Technical Library | 2010-10-21 16:01:17.0
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab
Technical Library | 2014-09-04 17:43:19.0
The counterfeiting of electronic components has become a major challenge in the 21st century. The electronic component supply chain has been greatly affected by widespread counterfeit incidents. A specialized service of testing, detection, and avoidance must be created to tackle the worldwide outbreak of counterfeit integrated circuits (ICs). So far, there are standards and programs in place for outlining the testing, documenting, and reporting procedures. However, there is not yet enough research addressing the detection and avoidance of such counterfeit parts. In this paper we will present, in detail, all types of counterfeits, the defects present in them, and their detection methods. We will then describe the challenges to implementing these test methods and to their effectiveness. We will present several anti-counterfeit measures to prevent this widespread counterfeiting, and we also consider the effectiveness and limitations of these anti-counterfeiting techniques.
Technical Library | 2013-10-10 16:28:21.0
In the past 15 years, stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections, and sensor circuit technologies. In the meantime, a wide variety of processes using many different materials have been explored in this new field. In the current contribution, we present an approach inspired by conventional rigid and flexible printed circuit board (PCB) technology.
Technical Library | 2007-11-21 11:39:13.0
This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted.
Technical Library | 2011-12-15 17:21:42.0
manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac
Technical Library | 2018-08-08 21:55:00.0
180 °C and Td >400 °C. In addition to a high thermal stability, Material A also shows a dielectric loss factor lower than commercial phosphorus-based flame retardants.
Technical Library | 2020-09-16 21:24:56.0
Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.
Institute for Factory Automation and Production Systems (FAPS)
Technical Library | 1999-07-21 08:49:49.0
As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.
Technical Library | 2010-06-24 21:20:05.0
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
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