Technical Library | 2023-01-17 18:00:39.0
EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION.
Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
Technical Library | 2023-01-17 18:04:51.0
As a manufacturing technology, SMT has acquired a "heritage" of widely accepted assumptions about its processes. However, yesterday'spractices are continually confronted by the shifting paradigms of today's production line.
Technical Library | 2012-02-23 21:16:28.0
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
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