Technical Library | 2001-05-23 16:36:43.0
Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing.
Technical Library | 2001-05-23 16:34:10.0
Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement.
Technical Library | 2020-03-08 11:47:14.0
Lubrication Grease, use the right one for the job. Insight into lubrication classification. selection and application of greases. Compare the properties of greases and check those used in your equipment that are suited to the service.
Technical Library | 2009-08-19 18:13:59.0
There are several advantages to using a contract assembler. One of which is maintaining the ability to dictate desired results. Therefore, how those results are achieved becomes someone else's concern. When you combine this with the fact that many contract assemblers are not accustomed to saying "no," you become a witness to the birth of innovation.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2017-07-20 15:18:15.0
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.
Technical Library | 2022-08-17 01:21:54.0
Back in the "good old days," stencil cleaning was effortless and effective. CFC-based solvents were sprayed or wiped onto a stencil with apertures hundreds of times larger than modern-day components. The stencil cleaning process was not considered a value-added procedure; instead it was the cleaning of a production tool. How times have changed. The late-1980s ushered in the end of most of the popular solvents, and the machines that consumed them. Assemblers turned to alternative cleaning agents, including IPAs and other solvents.
Technical Library | 1999-05-06 14:39:20.0
ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.
