Technical Library | 1999-07-20 09:15:30.0
What affects the price of boards? Number of layers: Limit the number of layers as much as possible. If higher quantities are anticipated, spend the extra time and money in engineering to minimize layer count....
Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2000-07-14 14:52:33.0
The acronym "EPA" has cast almost as much fear in the hearts of industry as the letters "IRS." The Environmental Protection Agency has a plan to improve its image and actually help manufacturers attain their goals and ISO 14001 requirements.
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2020-08-16 14:50:25.0
Not all desiccant bags are created or perform equally. Performance measures include: a) How long does desiccant last? b) How much are can be desiccated in a given area? c) How much moisture is retained, and or released back into the atmosphere? This article walks engineers through various test they can perform to determine efficacy. Additionally, the article highlight between adsorption vs adsorption.
Technical Library | 2001-05-23 16:36:43.0
Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing.
Technical Library | 2010-09-30 21:07:29.0
As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays an important role in almost every modern electronic device. However, there still is not a perfect PCB manufacturing proces
Technical Library | 2012-02-16 16:53:16.0
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel
Technical Library | 2021-03-18 20:03:27.0
Much has been said and written about the accuracy of visual attribute inspections of potentially counterfeit components. The techniques and procedures being used to inspect counterfeit and reworked electronic components in the open marketplace can be quite effective in most cases.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
