Technical Library | 2016-03-03 17:25:26.0
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Technical Library | 2022-01-12 19:26:19.0
Autonomous vehicles have the potential to revolutionize the automotive industry and are gaining immense attention from academia as well as industry. However, facets of autonomous vehicle systems related to the interconnection of independent components pose vulnerabilities to the system as a whole. These vulnerabilities aren't guaranteed to be solved by traditional security methods. Blockchain technology is a powerful tool that can aid in improving trust and reliability in such systems.
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